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NUF9001FC 10 Line EMI Filter
This device is a ten-line EMI filter array for wireless applications. Greater than -35 dB attenuation is obtained at frequencies from 800 MHz to 3.0 GHz. ESD protection is provided across all capacitors.
Features http://onsemi.com
LOW-PASS FILTER INPUT OUTPUT
* EMI Filtering and ESD Protection * Integration of 30 Discretes * Provides Protection for IEC61000-4-2 (Level 4) * * * *
Benefits
* Reduces EMI/RFI Emissions on a Data Line * Integrated Solution Offers Cost and Space Savings * Reduces Parasitic Inductances Which Offer a More "Ideal" Low Pass * Integrated Solution Improves System Reliability
Applications
A1
Flip-Chip CASE 499G
Filter Response
* * * *
EMI Filtering and ESD Protection for Data Lines Cell Phones Handheld Products MP3 Players
E
NUF9001 = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location)
PIN CONFIGURATION (Ball Side)
1 O1 O6
GND
2 O2 O7
GND
3 O3 O8
GND
MAXIMUM RATINGS (TA = 25C unless otherwise noted)
Rating ESD Discharge IEC61000-4-2 Contact Discharge Symbol VPP PR PT TOP TSTG TJ Value 8.0 100 200 -40 to +85 -55 to +150 +125 Unit kV C mW mW C C C A B IN6 IN1 IN7 IN2 IN8 IN3 IN9 IN4 IN10 IN5
GND GND
D
Steady-State Power per Resistor Steady-State Power per Package Operating Temperature Range Storage Temperature Range Junction Temperature
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
Device NUF9001FCT1 NUF9001FCT1G Package Flip-Chip Flip-Chip (Pb-Free) Shipping 3000 Tape & Reel 3000 Tape & Reel
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NUF9001FC/D
(c) Semiconductor Components Industries, LLC, 2006
March, 2006 - Rev. 5
1
CC CC
4 O4 O9
8.0 kV (Contact) Flip-Chip Package Moisture Sensitivity Level 1 ESD Rating: Machine Model = C; Human Body Model = 3B Pb-Free Package is Available*
RI/O = 100 W Cinput = 28 pF
MARKING DIAGRAM
NUF9001 AYWWG G
5 O5 O10
NUF9001FC
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Maximum Reverse Working Voltage Breakdown Voltage Leakage Current Series Resistance Capacitance Cut-Off Frequency Symbol VRWM VBR IR RA CLINE 1 f3dB Test Conditions - IR = 1.0 mA VRM = 3.0 V - f = 1.0 MHz, 0 Vdc (Above this frequency, appreciable attenuation occurs) Min - 6.0 - 170 - - Typ - 7.0 - 200 45 100 Max 5.0 8.0 0.1 230 50 - Unit V V mA W pF MHz
TYPICAL PERFORMANCE CURVES
(TA = 25C unless otherwise specified) 0 -5 -10 -15 S21 (dB) -20 -25 -30 -35 -40 -45 -50 1.E+06 Channel 2, 3, 4 and 8 1.E+07 1.E+08 FREQUENCY (Hz) 1.E+09 1.E+10 Channel 1, 5, 7 and 9 Channel 6 or 10 0 -10 -20 S41 (dB) -30 -40 -50 -60 -70 -80 1.E+06 1.E+07 1.E+08 FREQUENCY (Hz) 1.E+09 1.E+10 Channel 6 to Channel 7 Channel 1 to Channel 2 Channel 3 to Channel 4 Channel 3 to Channel 8
Figure 1. Insertion Loss Characteristics (S21 Measurement)
Figure 2. Analog Crosstalk Curve (S41 Measurement)
50 40 CAPACITANCE (pF) RESISTANCE (W) 0 1 2 3 4 5 30 20 10 0
220 215 210 205 200 195 190 185 180 -40 -15 10 35 60 85
REVERSE VOLTAGE (V)
TEMPERATURE (C)
Figure 3. Typical Line Capacitance vs. Reverse Bias Voltage
Figure 4. Typical Resistance Over Temperature
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2
NUF9001FC
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter PCB Pad Size Pad Shape Pad Type Solder Mask Opening Solder Stencil Thickness Stencil Aperture Solder Flux Ratio Solder Paste Type Trace Finish Trace Width Copper Solder mask 500 mm Pitch 300 or 350 mm Solder Ball 250 mm +25 -0 Round NSMD 350 mm "25 125 mm 250 x 250 mm sq. 50/50 No Clean Type 3 or Finer OSP Cu 150 mm Max
NSMD
SMD
Figure 5. NSMD vs. SMD
0- 15 - 30 - 45 - 60 - 75 - 90 - 105 - 119 - 134 - 149 - 165 - 180 - 195 - 209 - 224 - 239 - 254 - 269 - 284 - 299 - 314 - 329 - 344 - 359 - 374 - 389 - 404 - 419 - 434 - 449 - 464 - 479 - 494 -
280 270 260 250 240 230 TL= 217 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0
- - - - - - - - - - - - - - - - - - - - - - - - - - - -
Tp = (15-30 sec) Tp = 260C - 5C RAMP-UP
TEMPERATURE (C)
tL (60-90 sec)
RAMP-DOWN
PRE-HEAT ZONE
TIME (seconds)
Figure 6. Typical Pb-Free Solder Heating Profile http://onsemi.com
3
NUF9001FC
PACKAGE DIMENSIONS
FLIP-CHIP-25 CSP CASE 499G-01 ISSUE A
D A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. DIM A A1 A2 D E b e D1 E1 MILLIMETERS MIN MAX --- 0.650 0.210 0.270 0.380 0.430 2.650 BSC 2.650 BSC 0.290 0.340 0.500 BSC 2.000 BSC 2.000 BSC
4X
B
PIN A1 LOCATOR
0.10 C A 0.05 C A2 SIDE VIEW A1 D1 e
E D 25 X
b
C B A 1 2 3 4 5
0.05 C A B 0.03 C
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
C C
TOP VIEW e BOTTOM VIEW
0.10 C
E
C
SEATING PLANE
E1
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4
NUF9001FC/D

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